The instrument is designed for a variety of thin-film applications, including high resolution rocking curves, reciprocal space mapping, X-ray topography (digital imaging), X-ray reflectivity, Grazing Incidence XRD, Phase ID, residual stress, film texture and grain size analysis. The sample stage consists of a robust 5-axis Eulerian cradle, with full 300 mm wafer mapping, and capacity for both large and small samples. Multiple sample locations for smaller samples are provided to enable multiple measurements across multiple samples to be queued and performed automatically, even of different measurement types. Leading edge data analysis packages, such as JV-RADS and JV-REFS, provide expert data presentation and interpretation. The JV-DX is the ideal, multi-application thin-film materials research tool – for now and into the future.