SAN FRANCISCO, California – July 11, 2017 – At SEMICON West 2017, Bruker’s Semiconductor Division today announced that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray Diffraction Imaging Systems for in-line wafer monitoring of crystalline defects. The JVSensus-600E tool is equipped with both high-speed and high-resolution X-ray diffraction imaging (XRDI) measurement capabilities for detecting and classifying a wide range of crystalline defects induced by high-stress processes, such as fast annealing and CMP, or by poor wafer handling. The JVSensus system allows defects to be identified prior to annealing, which is often the critical step that leads to wafer breakage and severe yield loss. By detecting defects early in the process, semiconductor manufacturers can quickly identify the root cause of processes causing wafer breakage and reduce yield loss.

“We are delighted to have been selected by industry-leading customers to provide defect inspection systems for their production yield improvement,” said David V. Rossi, President of the Bruker Semiconductor Division. “We see these shipments as further validation of the value that early detection of critical defects brings to our customers in reduction of wafer breakage."

“As the industry utilizes more aggressive steps within more advanced technology nodes, such as fast annealing strategies, new non-visual defect detection challenges arise,” added Isaac Mazor, Vice President and General Manager of Bruker’s X-ray Semiconductor business. “The JVSensus-600E system is capable of detecting a wide range of crystalline defects using X-ray diffraction imaging technique, and is optimised for both blanket and pattern wafers on a single system. This allows a fab to efficiently ramp up processes and quickly identify crystalline defects on product wafers to minimize yield loss from wafer breakage in their production line."

About JVSensus-600E

JVSensus-600E is a production-worthy XRDI system for detecting and classifying crystalline defects in single crystal wafers, and can be used for both in-fab process development and production monitoring. The tool is able to detect a wide range of crystalline defects that may be induced mechanically or through thermal treatments. It is capable of performing defect recognition analysis on the images to extract defect parameters, such as their size and their location across the wafer, as well as present the results as a standardized defect map compatible with the latest KLARF format. Additionally, with its high-resolution cross section capability, JVSensus-600E can also provide information on whether the defects appear on the front or the backside of the wafer, which is of prime importance in finding the root cause of the crystalline defects. XRDI is a technique that allows the user to detect non-visual defects on blanket, patterned and metallised wafers that would go undetected by existing optical inspections.

Media Contact:
Paul Ryan
Bruker Semiconductor Division
T: +44 191 332 4812
E: Paul.Ryan@bruker.com

Mr. van Ingen served on the Company’s Board from 2012 to June 2017, and as a director of Bruker Energy & Supercon Technologies, Inc., a wholly-owned subsidiary of the Company, from 2009 to 2013. The Company’s Board and management are extremely grateful for Mr. van Ingen’s guidance and leadership over the years and extend their deepest condolences to his family.

Chris van Ingen served as an advisor to various life sciences and analytical technology companies since 2007, including Bruker and certain of its subsidiaries from 2008 until 2011. Mr. van Ingen also served as a director of Bruker Energy & Supercon Technologies, Inc. from 2009 through March 2013, including as chairman of the board of directors and member of the Compensation Committee from 2010 to March 2013. From 2001 until October 2007, he was President of the Life Sciences and Chemical Analysis Group at Agilent Technologies, Inc. Prior to joining Agilent, Mr. van Ingen was Vice President of Sales and Marketing at Hewlett Packard's Chemical Analysis Group and held other senior management positions at Hewlett Packard's Avondale Division and Netherlands Country Operation. Mr. van Ingen also served on the board of directors of Trinean N.V., a privately-held life sciences instrumentation company based in Belgium and on the board of directors of Lifeonics Limited, a privately-held life sciences company based in New Zealand. Mr. van Ingen previously served as chairman of the board of directors and as a member of Audit Committee of Accelrys, Inc. from 2010 to 2014 and served on the board of directors and Compensation Committee of Promega Corporation, a privately-held biotechnology company, from 2010 to 2015. He also served on the board of directors and Compensation Committee of ProteinSimple, a privately-held life sciences company, from March 2014 until July 2014. Mr. van Ingen held a B.S. degree in analytical chemistry. Mr. van Ingen brought to the board financial, sales and marketing, and general management experience in the analytical and life sciences industries, as well as significant experience in corporate governance, strategic planning and public company compensation matters. Most recently, Mr. van Ingen served on the Company's Audit Committee and Nominating Committee.

Webinar about VERTEX Vacuum FTIR Spectrometers for High-End Applications * Solutions for the Meat Processing Industry * Microplastics - IR Microscopy Helps to Research a Gobal Problem * verTera - Two Techniques, One Spectrometer, Highest Flexibility * Raman Microscopy for Pharmaceutical QC and R&D: Efficient and Validated * Visit us at Oils + Fats

View Newsletter

Webinar über VERTEX Vakuum-FT-IR-Spektrometer für High-End-Forschungsanwendungen * Bruker Optik Anwendertreffen 2017 * FT-NIR-spektroskopische Lösungen für die fleischverarbeitende Industrie * Mikroplastik - IR-Mikroskopie hilft bei der Erforschung eines globalen Problems * Raman-Mikroskopie für pharmazeutische QC und F&E: Effizient und validiert * verTera - zwei Techniken, ein Spektrometer, höchste Flexibilität * Besuchen Sie uns auf der LAB SUPPLY * Besuchen Sie uns auf dem Danube Vlata Sava Polymer Meeting (DVSPM) * Besuchen Sie uns auf der Expopharm 2017 * Besuchen Sie uns auf der Oils + Fats

Newsletter anzeigen

SAN JOSE, California – June 27, 2017 – Bruker’s Nano Surfaces Division today announced the introduction of the TriboLab CMP Process and Material Characterization System, which provides a unique characterization capability for the development of chemical mechanical polishing (CMP) processes on the proven robust UMT TriboLab™ mechanical testing platform. The new TriboLab CMP system is the only tool on the market that can provide a broad range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for the accurate and complete characterization of CMP processes and consumables.

”CMP is more critical than ever for advanced semiconductor device fabrication. The industry has been calling for a means to effectively characterize the detailed process and consumables interactions that take place while polishing a wide range of materials,” said Dr. Robert Rhoades, CTO of Entrepix, a leading provider of equipment and wafer processing services to the CMP industry. “We are pleased to partner with Bruker and assist in the launch of the TriboLab CMP platform. With the addition of this new system to our capabilities, we are poised to provide a reliable R&D solution for testing and characterization of complex interactions among pads, slurries, conditioning, and process parameters with unmatched repeatability and detail.”

“Bruker has supplied instruments for this application for well over a decade, and we are delighted to introduce TriboLab CMP as the latest generation product of this family. TriboLab CMP has already demonstrated superior capabilities at customer sites on some of the most challenging CMP applications development in the semiconductor industry,” added James Earle, Vice President and General Manager of Bruker’s Tribology, Stylus and Optical Metrology Business. “It is the only tool on the market that can provide the broad polishing pressure and speed ranges, acoustic emission data, friction, and surface temperature for accurate and complete characterization of CMP processes and consumables.”

About TriboLab CMP

Built on the industry-proven UMT TriboLab mechanical tester platform, the TriboLab CMP system’s accuracy and measurement repeatability enables the highly effective qualification, inspection, and ongoing functionality testing required throughout the CMP process. TriboLab CMP delivers standard on-board diagnostics for better understanding of polishing processes, providing radically more visibility into transient polishing properties. Data is collected from the instant the substrate touches the pad and throughout the entire test, enabling early-stage process development decisions through more complete, detailed data. The system also allows testing on small coupons for substantial cost savings over whole-wafer testing.

Media Contact:
Stephen Hopkins
Marketing Communications
Bruker Nano Surfaces
T: +1 (520) 295-4373
E: steve.hopkins@bruker.com