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X-Ray Defect Inspection for Wafers

Bruker defect detection systems use X-ray diffraction imaging (XRDI) to detect crystalline defects, such as cracks, slip, dislocations, and micropipes on single-crystal substrates.

These systems can detect the cracks that cause wafer breakage in Si wafers within semiconductor fabs. This defect inspection is performed without the use of etching acids. They can also be used to improve yield and quality of other high-value substrates, such as CdTe and SiC. 

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JVSensus

XRDI inspection system for crystaline defects in patterned and blanket wafers

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JV-QCTT

X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in wafers and ingot slices

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JV-QCRT

X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in high value substrates