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Sirius-RF

Overview

The Sirius-RF is the fourth generation system in a mature platform to provide industry standard reliability, ease-of-use, fab automation, and SEMI standard compliance.

The Sirius-RF features:

  • Convergent beam XRR for fast, first-principle thickness and density measurements on scribe-lines
  • Dual source µXRF configuration for flexibility and best performance for variety of layers per device

    • For advanced memory (DRAM, PCRAM, 3D-NAND, MRAM), Logic, power devices and packaging

  • Composition and thickness measurement

    • On metrology pads or directly on-device (non-destructive manner)
    • Multi-stack measurement capability

 

 

Sirius RF System

Application Example: PCRAM

Sirius RF Applications on PCRAM
  • Composition and thickness of the memory element (GeSbTe - GST) and Ovonic Threshold Switch (OTS, GeAsSe) are critical parameters
  • Sirius-RF µXRF allows in-line composition monitoring on metrology pads or device areas
  • Fast convergent beam XRR allows thickness measurement at 1-2 seconds per point

  • Composition and thickness of the memory element (GeSbTe - GST) and Ovonic Threshold Switch (OTS, GeAsSe) are critical parameters
  • Sirius-RF µXRF allows in-line composition monitoring on metrology pads or device areas
  • Fast convergent beam XRR allows thickness measurement at 1-2 seconds per point