Semiconductor & Nanotech

Electronic Components (RoHS)

Analysis of Electronic Components

Controlling the composition and thickness of integrated circuits and electronic components is a key to increase their reliability and power efficiency. Bruker offers fast and non-destructive analytical solutions to determine the device and its layers composition and thickness, also required when screening for hazardous materials.

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PCB Thickness and Composition

Controlling the thickness and composition of layers in PCB devices is important for their durability as well as for soldering or bonding. Bruker offers analytical solutions to investigate PCB layers with EDS (StrataGEM) and micro-XRF (XMethod) techniques.

Restricted Materials Screening (RoHS)

Due to health and safety, as well as environmental regulations, it is imperative to investigate and understand the composition of products with regards to 'Restriction of Hazardous Substances Directive'. Part of this is the restriction on use of Pb containing solder.