X-Ray Defect Inspection Systems
Advanced Inline X-Ray Imaging
Bruker defect detection systems use X-ray diffraction imaging (XRDI) to detect crystalline defects on single-crystal substrates, such as slip, cracks, dislocations, and micropipes. Operating without the use of etching acids, our non-contact XRDI inspection systems are broadly employed to detect cracks in Si wafers that cause wafer breakage and to improve yield and quality of other high-value substrates such as GaN, CdTe, and SiC.
Find the Best X-Ray Defect Inspection System for You
X-Ray Defect Inspection Solutions for Semiconductor Manufacturing Applications
Bruker's X-ray diffraction imaging (XRDI) solutions support non-contact defect detection and classification for semiconductor substrates, helping manufacturers identify crystalline defects, improve yield, and maintain substrate quality across development and production environments.
Contact us to discuss your measurement requirements, find out about the systems best-suited for your application, discuss options for system specialization, or request a quote based on your specific needs.
Advanced Packaging Defect Inspection
Support process monitoring and characterization of thin-film properties across semiconductor manufacturing applications.
- Inline control for multi-layer film thickness and refractive index on micron-sized device features
- Inline composition control (e.g., %Ge in SiGex) for thin films
- Inline process control of thin metal oxide thickness to prevent non-wet open failures
Crystalline Defect Detection & Monitoring
Identify crystalline defects in semiconductor substrates using non-contact X-ray diffraction imaging.
- Thin film crystalline defect monitoring
- Slip detection
- Crack detection
- Dislocation detection
- Micropipe detection
Wafer Quality & Process Characterization
Support wafer quality assessment and process optimization through defect mapping and substrate inspection.
- Warpage and tilt mapping for advanced processors
Wetting & Manufacturing Quality Analysis
Evaluate manufacturing-related defects that influence assembly quality and device reliability.
- Wetting behavior analysis for automotive controllers
- Automatic non-wet detection for wireless chips
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