Automated X-ray Wafer Inspection

Bruker provides the world’s most advanced and non-destructive X-ray technology solutions for thin-film metrology. Our characterization solutions cover the full range of processing in both logic and memory. Bruker has specialized systems for identifying substrate defects and performing front end of line control of epi films and high-k dielectrics, as well as dedicated instruments for analyzing metal films and wafer-level packaging bumps. These systems also routinely perform other semiconductor metrology applications for hard disk drive materials, GaN on Si power transistors, and PZT film composition and phase monitoring.

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JVX7300F-W

Process Control of Bump and Under-bump Metal in Advanced Wafer Packaging

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JVX7300LSI

In-fab R&D and In-line Production Process Monitoring

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JVX7300RF-T

Multi Channel Metrology for Measurement of Thin Metal Films

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JVX7300HR

HRXRD for epilayer quality control of SiGe