X-Ray Metrology For Silicon Semiconductors


Fourth generation system to provide industry standard reliability

SEMI standard compliance

Punti salienti


The Sirius-RF is the fourth generation system in a mature platform to provide industry standard reliability, ease-of-use, fab automation, and SEMI standard compliance.

Convergent Beam
Offers fast, first-principle thickness and density measurements on scribe-lines
Dual Source
µXRF configuration
Delivers flexibility and best performance for a variety of layers per device
measurement capability
Composition and thickness measurements on metrology pads or directly on-device in a non-destructive manner



Sirius-RF Features

  • Convergent beam XRR for fast, first-principle thickness and density measurements on scribe-lines
  • Dual source µXRF configuration for flexibility and best performance for variety of layers per device
  • For advanced memory (DRAM, PCRAM, 3D-NAND, MRAM), Logic, power devices and packaging
  • Composition and thickness measurement
  • On metrology pads or directly on-device (non-destructive manner)
  • Multi-stack measurement capability



Application Example: PCRAM

  • Composition and thickness of the memory element (GeSbTe - GST) and Ovonic Threshold Switch (OTS, GeAsSe) are critical parameters
  • Sirius-RF µXRF allows in-line composition monitoring on metrology pads or device areas
  • Fast convergent beam XRR allows thickness measurement at 1-2 seconds per point.



How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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