In Situ SEM Nanomechanics with Bruker’s PicoIndenter – Webinar and Demonstration of Hysitron SEM PicoIndenter
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In this webinar, two experts in the field of in situ nanomechanics present their latest research. Dr. Kris Vanstreels’s talk will be focused on understanding the strength and reliability of back-end-of-the-line (BEOL) layer stacks, which are utilized in the microelectronics industry. Dr. Peter Hosemann will discuss deformation mechanisms of materials at cryogenic temperatures. After the guest speakers conclude their presentations, the Bruker team will introduce and demonstrate the next generation Hysitron SEM PicoIndenter.
- Mechanical stability of advanced nano-interconnects -- Dr. Kris Vanstreels, IMEC
- Micromechanical testing at cryostatic temperatures fracture and microstructural changes evaluated -- Dr. Peter Hosemann, UC Berkeley
- Demonstration -- Eric Hintsala and Sanjit Bhowmick, Bruker