Nanoindentation is a versatile technique used to measure localized mechanical properties rapidly and accurately for broad classes of materials. By combining environmental control and ease of sample mounting, nanoindentation is well suited to study the various dissimilar and vast materials used within material joining.
Mechanical Material Joining: Bolting, riveting, and clamping are familiar examples of mechanical fastening. Nanomechanical measurements may be conducted under controlled environments ranging from harsh oxidizing conditions to elevated temperatures. Bruker’s Hysitron electrochemical, gaseous, fluid, or temperature control options enable localized mechanical property measurements of mechanically fastened materials while replicating in-service conditions. Site-specific mechanical characterization of pitting caused by localized corrosion attack in steel rivets submerged in seawater, or effects of intergranular corrosion on the nanomechanical behavior of a gusset plate would be two potential applications of nanomechanical characterization, among many.
Physical Material Joining: Bonding materials together by phase changes (i.e. crystallization from a melt), evaporation of solvents in glues, or diffusing two materials together are ways of physically joining materials. To better understand time and temperature influence on diffusion parameters from diffusion bonding, accurate and fast measurements of property gradients through diffusion zones may be conducted using spatial resolution provided by nanoindentation.
Chemical Material Joining: Chemical processes to join materials together involves the interaction of intermolecular forces (e.g. covalent bonds, van der Waals) between two materials. Implementing nanoindentation for pull-off force measurements of tacky resins used in pressure sensitive adhesives, or utilizing dynamic characterization to measure curing of epoxy resins at various temperatures are common applications.
Soldering or welding are traditional material joining techniques that can be categorized as a merge between physical and chemical bonding. When two metals are fused together by heat, the microstructure at the interface unavoidably changes producing alterations in mechanical behavior, and ultimately weld performance. Using nanomechanical characterization to investigate the extent of the heat affected zone from a weld, or measuring the mechanical integrity of lead-free solder bumps for microelectronics at elevated temperatures offer powerful insight for designing advanced materials.