X-Ray Defect Inspection

JVSENSUS-600F

Qualify and monitor process tools at any technology node to reduce cycle times and facilitate fab expansion

X-ray diffraction imaging (XRDI) inspection system

JVSensus-600F

하이라이트

JVSensus-600F

The JVSensus-600F is the X-ray defect metrology system for 300mm Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.
 

특징

Features

Easily Identify Crystalline Defects

JVSensus enables its users to identify cracks and other defects in the wafer which can cause catastrophic structural failure, BEFORE the breakage occurs. Once a defect has been observed, non-destructive cross section review images can be performed to locate the defect locations within the wafer depth.

Measure on Patterned Wafers

Measurements can be performed on blanket, patterned, and metalized wafers without sample preparation. The defects can be identified even when a pattern is present on the wafer. 

Detect Slip

The major cause of overlay issues is slip. Whether it's a logic patterned wafer, GaN on Si or ingot slides, JVSensus can detect slip in minutes.

지원

Support

How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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