Bruker defect detection systems use X-ray diffraction imaging (XRDI) to detect crystalline defects, such as cracks, slip, dislocations, and micropipes on single-crystal substrates.

These systems can detect the cracks that cause wafer breakage in Si wafers within semiconductor fabs. This defect inspection is performed without the use of etching acids. They can also be used to improve yield and quality of other high-value substrates, such as CdTe and SiC.