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Hysitron PI 89 SEM PicoIndenter

Next-Generation In-Situ Nanomechanical Test Instrument

The Hysitron PI 89 SEM PicoIndenter leverages the advanced imaging capabilities of scanning electron microscopes (SEM, FIB/SEM), making it possible to perform quantitative nanomechanical testing while simultaneously imaging. Based upon Bruker’s leading-edge capacitive transducer technology, this new system is the next-generation descendant of the first commercial, market-leading in-situ SEM nanomechanics platforms. Throughout the years, the Hysitron brand has steadily expanded the range of PicoIndenter capabilities, and extended force and displacement ranges with patented xR transducer technology and other exclusive advances. Innovative features of the PI 89 include the electrical characterization module (ECM), Push-to-Pull (PTP) tension for thin films and nanowires, direct-pull tension, fatigue, rotation/tilt stage (patent), elevated temperature testing, and nanoscratch, making it the most comprehensive in-situ nanomechanical test instrument for SEM and FIB/SEM available today.

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Hysitron PI 89 SEM PicoIndenter
surface analysis
Real-Time Imaging
Video capture from the SEM enables real-time monitoring and direct correlation of mechanical data to microscope imaging.
Hysitron-SEM-PicoIndenter-Nanoscratch-BRUKER.png
Shed light on deformation processes occurring at the sliding interface with nanoscratch testing.

True Displacement Control with Piezo-Driven Flexure Mode

Hysitron PI 89 utilizes Bruker’s proprietary sub-nanometer sensitivity transducer and piezo-driven flexure for true displacement-controlled tests. The low-load transducer can apply force electrostatically while simultaneously measuring displacement capacitively. The displacement range can also be increased dramatically (max 150 μm) in flexure-driven mode. The uniquely low-current design of the transducer minimizes thermal drift and provides unprecedented sensitivity. This is coupled to an encoded XYZ stage with 12 x 26 mm range for sample positioning and 29 mm in indentation axis, providing greater access to larger samples. This mechanical integration of sample stage and transducer on a single platform provides a stable foundation for superior lateral precision, linearity, and repeatability.

Advanced Performance and Functionality

The Hysitron PI 89 mounts easily to the SEM stage without being a permanent fixture in the microscope. The compact design of the instrument allows for maximum stage tilt and minimum working distance to enable optimal imaging during testing. The new, redesigned platform features increased versatility and ease of use over the industry-standard PI 88 system by adding a simple sliding stage mount to the sample side of the system. This allows for quick and simple adjustment of the sample position relative to the transducer, and accommodates swapping probes, samples and add-on options while also increasing the available space for larger samples, additional stages, and new options. In addition, the new encoded linear stages allow for greater repeatability during automated motions and while increasing travel range. Improved frame stiffness was accomplished by redesigning the mechanical load frame axis.

Rotation/Tilt Stage Configurations
Two rotation/tilt stage configurations available with next-generation system design.
PI 88

Hysitron PI 89 Features

  • Proprietary interchangeable transducer technology provides extended range (10 mN, 500 mN, 3.5 N, and 150 μm) in-situ nano- to micro-scale mechanical testing
  • Exclusive load and displacement-controlled testing modes enable nanoindentation, compression, tension, fatigue, or bending tests
  • New encoded stage technology (1 nm resolution) enables indentation within nanocrystalline grains
  • Two rotation/tilt stage configurations enable better sample positioning for nanomechanical testing, secondary electron imaging, in-situ FIB milling, and analytical imaging
  • Futureproof modular design allows for upgradability of in-situ testing techniques, including 800°C heating, scratch testing, electrical characterization, scanning probe microscopy (SPM) imaging, property mapping (XPM), and dynamic fatigue testing
  • Performech II Advanced Control Module delivers 78 kHz feedback rate and data acquisition up to 39 kHz to capture transient events, such as fracture initiation