Small-Spot Capabilities of JVX7300LSI System Enable Development of Advanced Technology Nodes
SAN FRANCISCO, California – July 12, 2016 – At SEMICON West, Bruker today announced that multiple leading logic and foundry manufacturers have selected Bruker’s JVX7300LSI X-ray metrology system to support their ramp and development for 10 nanometer (nm) and 7/5 nm technology nodes. The JVX7300LSI tool is equipped with both large and small spot measurement capabilities for in-line production process monitoring of the most advanced logic devices. The tool was selected by the manufacturers following a comprehensive evaluation of extremely challenging measurements across a variety of front-end applications, including SiGe and Ge epitaxial analysis on Si and SRB, finFETs and (FD)SOI, III-V, and other materials such as high-k/metal gate characterization.
“We are delighted to have been selected by industry-leading semiconductor customers to provide an unparalleled metrology solution for advanced epitaxial processes,” said David V. Rossi, President of the Bruker Semiconductor Division. “Strengthening our position in fab-based X-ray metrology was part of the rationale behind Bruker’s acquisition of Jordan Valley Semiconductors in 2015, and we view this selection as further proof of our technology leadership as a provider of advanced X-ray based solutions."
"As the industry moves to 10 and 7/5 nanometers, new metrology requirements and challenges are presented,” added Isaac Mazor, Vice President and General Manager of Bruker’s X-ray Semiconductor business. “The JVX7300LSI system is an ideal tool for a wide range of applications, providing the metrology required to overcome many challenges during the development and manufacturing of these processes. It is capable of a wide range of X-ray based characterization and metrology techniques—HRXRD, XRR and various XRD geometries—and is optimized for both blanket and pattern wafers, all on a single system."
About the JVX7300LSI System
The JVX7300LSI is a production-worthy X-ray metrology system for advanced logic and “More-than-Moore” applications, such as III-V compound semiconductors on Si, and can be used for both in-fab process development and production monitoring. The tool supports a wide range of X-ray metrology modes to provide solutions for a large variety of materials and structures. It is capable of measuring the composition, thickness and strain/relaxation of single and multiple epilayer stacks using both large- and small-spot HRXRD. Additionally, with XRR and (GI)XRD channels, JVX7300LSI can also provide information on the thickness and density of a wide range of thin films, as well as unique microstructure information, such as crystallinity, grain-size and phase, of polycrystalline thin-films. Unlike optical or spectroscopic tools, HRXRD (high-resolution X-ray diffraction) and XRR (X-ray reflectometry) are first principle techniques that deliver accurate and precise results without calibration.
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