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Small R&D-Scale Specialty System for CMP

Polishing Process Control for Process Development and Materials Testing

The new TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes.

  • Reproduces full-scale wafer polishing process conditions without downtime on production equipment
  • Provides unmatched measurement repeatability and detail
  • Allows testing on small coupons for substantial cost savings over whole-wafer testing

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UMT CP 4 polished sample1
Interior CMP

The Standard for Mechanical Test Labs

Leveraging over 20 years of CMP characterization expertise with its predecessor product (Bruker CP-4), TriboLab CMP brings a complete set of capabilities to the industry-leading TriboLab™ platform. TriboLab CMP is the only process development tool on the market that can provide a broad range of polishing pressures (0.05 - 50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for accurate characterization of CMP processes and consumables.

On-board Diagnostics for Better Understanding of Polishing Processes

  • Delivers more visibility into transient polishing properties than any other system on the market
  • Collects data from the instant the substrate touches the pad and throughout the entire test
  • Enables early-stage process development decisions through more complete, detailed data


At right: Testing Conditioning Discs on CMP Tester. Tests identify two groups of discs. Friction coefficient tests correlate with pad wear.

Testing conditioning discs
Schematic of CMP Tester for Conditioner-Pad Tests

Flexibility in Sample Type, Size, and Mounting Configurations

  • Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
  • Accomodates small coupons through whole 100mm wafers with ease
  • Accepts multiple sample mounts for flexibility


At left: Schematic of CMP Tester For Conditioner-Pad Tests

On-Demand Webinar: Accelerating Process Optimization and Consumable Development for Chemical Mechanical Planarization