Semiconductor Metrology JVX7300F-W

JVX6200iF Galaxy

Production-line proven X-ray metrology platform for μ-bump Sn/Ag composition. Micro spot XRF for Wafer Level Packaging metrology

JVX6200iF features small spot XRF, for robust measurement of complex patterning. JV's technology roadmap is inline with µ-bump scaling and can measure bumps smaller than15µm. JV tools can measure solder cap (~3µm) on top of Cu pillar as single bump.

JVX6200iF products


XRF (X-Ray Fluorescence)


Thickness, elemental analysis and composition of thin and thick metal layers for the FEOL, BEOL and WLP: