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Process Control of Bump and Under-Bump Metal in Advanced Wafer Packaging


Sirius-FW is the next generation system from Bruker for process control in advanced wafer level packaging. It specializes in the inspection of individual bumps down to 15µm size and under-bump metal. The Sirius-FW features µXRF technology to enable detection of the Ag composition of SnAg bumps, composition of under bump metals and even profiling of composition within a single bump.

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Sirius-FW System

Bump Composition and Profile

Due to the extremely small X-ray spot size, unlike competitor systems, the measurement of individual bumps is possible. In this example, the small beam is used to profile the Ag composition across a single bump.

JV7300 Bump Solder v1a
JVX7300F W Poor bump image v1
Sirius-FW Wafer Maps

UBM Composition

The composition of the UBM can be quickly and reliably obtained, with fast mapping over the full 300mm wafer. Maps of composition of Au, Pd and Ni can be automatically generated.