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Chemical Mechanical Planarization

Chemical mechanical planarization (CMP) is a process where an abrasive pad along with a physically and chemically active slurry are used to polish a surface.

Chemical mechanical planarization (CMP) is a process where an abrasive pad along with a physically and chemically active slurry are used to polish a surface.  The requirements for current semiconductor manufacturers are to control the overall flatness of the surface to ~1nm regardless of any underlay contrast in material or geometry.  The Atomic Force Profiler (AFP) can be used to determine both the localized dishing & overall layer erosion (D&E).  The Dimension AFP can be used to control the production process for CMP on all layers such as shallow trench isolation (STI), tungsten plug, contacts & vias or copper lines.

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Depth Metrology

For many production processes it is essential to control the depth or height of the output.  This is especially important in the case of semiconductor etch processes...

For many production processes it is essential to control the depth or height of the output.  This is especially important in the case of semiconductor etch processes where depending on the layer the impacts of a nanometer in variation can cause significant problems like short/open circuit, high leakage current, loss of contact, etc.  Providing atomic z-resolution the AFM is ideally suited to collect the process data advanced semiconductor manufacturers demand for high yielding device fabrication.

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Roughness

Introduction of new materials and deposition processes such as High-K metal gate for semiconductor transistor fabrication, or low-k porous dielectric materials requires information about the quality of the films and materials being deposited.

Introduction of new materials and deposition processes such as High-K metal gate for semiconductor transistor fabrication, or low-k porous dielectric materials requires information about the quality of the films and materials being deposited. Surface roughness characterization is an excellent tool to provide insight for R&D learning as well as providing quality control as processes mature into production.  The Bruker automated AFMs can be used to collect roughness data inline on 150mm, 200mm, 300mm and up to 450mm wafers.  This same technique can also be used to qualify incoming substrate quality for the semiconductor or LED manufacturer.

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Defect Review

Traditional inspection systems provide information only on the location of a defect.  Once the location is identified it is necessary to use a review technique to determine other characteristics such as size, shape, composition, etc.

Traditional inspection systems provide information only on the location of a defect.  Once the location is identified it is necessary to use a review technique to determine other characteristics such as size, shape, composition, etc.  Bruker automated AFMs can be used to automatically collect AFM images at known defect locations to provide a 3D profile of the defect.  This information can be used to aid in defect repair or understanding of cause of defect due to size and shape.  Bruker automated AFM systems support recipe creation directly from defect files for increased productivity.

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