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Features & Benefits

  • Combines the outstanding resolution of an atomic force microscope with the long-scan capability of an atomic force profiler
  • Delivers the fastest throughput of any AFM or profiler
  • Unsurpassed repeatability for in-line STI, W, Cu and CMP metrology
  • Replaces costly, destructive cross-sectioning techniques, reducing etch measurement turnaround from days to minutes
  • Exclusive TappingMode™ operation enables nondestructive measurement of high-aspect-ratio features

Applications

  • CMP process characterization (CU, W, STI dielectric, poly)
  • Industry-leading repeatability for CMP and etch depth metrology
  • Profiling and high-aspect-ratio depth measurements in a single platform
  • Applications in semiconductor, data storage, and LED industries
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Deep Trench (DT) Mode is an AFM mode developed specifically for the repeatable measurement of deep semiconductor trench structures for 90 nm and below. It is an adaptive scan method in which data is only collected when user-specified system state conditions
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