Atomic Level Resolution for All 450mm Metrology Needs

One tool metrology solution for depth, CD, side-wall angle, profile and roughness for full 450mm wafers.

Based on the production-proven InSight® 3DAFM platform for 300mm, the InSight-450 3DAFM is ideally suited for a broad range of roughness, depth and CD applications. Capabilities include bare wafer process validation, roughness characterization and pit/bump/scratch defect metrology; incoming substrate qualification; thin film and epitaxial deposition performance with micro/nano roughness and angstrom-level step height precision; etch depth metrology for process development and control, in-line resist profile measurements of CD, SWA, and LER with

full TEM-like profiles; and CMP flatness performance to monitor dishing and erosion. The flexibility of the InSight-450mm AFM means all of these applications are available in a single tool, thus reducing overall cost for metrology. The InSight-450 3DAFM provides this capability with no modeling required, full NIST traceability and no material or wafer damage, making it the ideal tool to provide early learning in 450mm process development with scalability to 450mm production.

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