Display and LED/OLED | Bruker

Display and LED/OLED

Nanomechanical and Interfacial Adhesion Characterization of Display Materials

Next-generation display technologies use unique combinations of flexible organic materials and relatively rigid inorganic layers. Mechanical failure of a multilayer device is determined by its weakest component, requiring materials and processes to be finely tuned to maximize performance and reliability. Mechanical property mismatches combined with residual stresses between deposition layers, thermal stresses due to thermal expansion mismatches, and external stresses applied to the devices add to the complexity of materials development. In addition to mechanical failures, stresses within the active layers may lower the efficiency of the devise as it deforms.

Bruker has developed a comprehensive suite of nanomechanical testing techniques to quantitatively measure the mechanical and interfacial properties of LEDs and OLEDs. Nanoindentation is a rapid means of characterizing the nanomechanical properties (e.g. modulus, hardness, fracture toughness, creep, and stress relaxation) of thin films and substrates used in display manufacturing. Dynamic nanoindentation measurements allow localized viscoelastic property and phase transition measurements to be conducted. Additionally, nanoscratch testing enables quantitative interfacial adhesion measurements between thin film layers. 

Standalone Test Equipment for Display Materials Characterization

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Test Equipment for Display Materials Characterization

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.


Hysitron PI 95 TEM PicoIndenter | Bruker

PI 95 TEM PicoIndenter

The first full-fledged depth-sensing indenter capable of direct-observation nanomechanical testing inside a transmission electron microscope (TEM).


Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.