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Automated AFMs

Bruker’s automated AFMs provide proven industrial metrology solutions for surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth measurements on the most current technology nodes and wafers. Dimension AFP is the world’s only metrology tool designed to measure both CMP and etch-depth, offering its users unmatched capabilities and precision. InSight-450 3DAFM is a one-tool metrology solution for non-destructive roughness characterization, thin-film and epitaxial deposition, etch depth, in-line resist profiling, and much more. All Bruker automated AFMs combine the repeatability of automation and the flexibility of multiple mode imaging with the precision of high-resolution AFM metrology.    

Industrial AFM Insight 450 v1

InSight-450 3DAFM

Atomic Resolution for 450mm Wafers

Automated AFM dimnension AFP v1

Dimension AFP

Automated Chemical Mechanical Planarization and etch metrology at 65nm.

Insight AFP tool image v1


Fully-Automated, Atomic-Level Force Control For CMP Wafers