S8 FABLINE, X-ray metrology, Surface Contamination Monitoring

Surface Contamination Monitoring in the Fab

The S8 FABLINE-T is the solution for monitoring trace metal contamination on the wafer surface by TXRF (Total Reflection X-Ray Fluorescence). It is a fast, non-destructive surface sensitive technique that does not require the use of fluids.

The S8 FABLINE-T has full mapping capability with 0 mm edge exclusion measurement. It contains multiple X-ray sources for the optimized excitation for light, medium and heavy elements. The intuitive user interface (PTO) assures failsafe operation of the tool. The full automatic wafer handling accepts wafers of 300 mm and 450 mm. Furthermore, the system is SEMI S2, S8 and CE compliant.