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Spatially Resolved Layer Thickness Analysis of Thin Metal Coatings with Micro-XRF

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Spatial distribution of composition (left) and analyzed thickness (right) of an Al-Cu-alloy on a glass substrate.
Spatial distribution of composition (left) and analyzed thickness (right) of an Al-Cu-alloy on a glass substrate.
Visualization of element distribution on pcb
Element distribution for Sn, Br, Au, Bi, Cu, Ni, and Si on a PCB (memory module).

A thorough understanding of coating thickness and composition of deposited films is crucial for manufacturers who apply a variety of coatings in their production processes. The spatially resolved distribution analysis capabilities of Bruker’s M4 TORNADO Micro-XRF spectrometer and the XMethod coating analysis software enable the analysis of coating composition and layer thickness of point measurements as well as distribution maps of coated areas.

 

This Webinar will discuss the creation of layer models in XMethod and the application of such analytical methods using the M4 TORNADO. The focus will be on metallic coatings on different substrates and for different applications such as Au/Pd/Ni on copper on a printed circuit board (PCB) and metallic coatings on glass. A comparison of results for calibration standards will be performed in order to demonstrate precision and reproducibility.

 

The webinar will be round off by a 15-minute Q&A session where our experts will answer your questions.

Speakers

  • Samuel Scheller, Sr. Product Manager Micro-XRF, Bruker Nano Analytics
  • Falk Reinhardt, Application Scientist Micro-XRF, Bruker Nano Analytics

Who should attend?

  • Quality control specialists assuring thickness and composition of thin metal coatings in the electronics industry
  • Coating quality control technicians responsible for quality assurance and failure analysis in coating services for PCBs
  • Researchers in R&D

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