RESOURCE TYPE: Technical Note [PDF]
LENGTH: 4 pages
DESCRIPTION:
This technical note explains how stylus profilometry is used to quantify thin film stress through wafer deformation and curvature measurements. It shows how direct surface measurements support stress calculations without relying on optical assumptions, and how radial mapping techniques improve confidence in results. The note provides practical context for applying these methods in thin film process development and characterization..
READERS WILL LEARN:
RESOURCE TYPE: Webinar
LENGTH: ~1 hour
RESOURCE TYPE: Application Note [PDF]
LENGTH: 4 pages
DESCRIPTION:
This application note presents step height measurement as a core thin-film use case for stylus profilometry. It shows how direct mechanical measurement provides a clear, traceable thickness or step value, and how this is used to validate optical results or resolve uncertainty in film measurements. The note outlines how setup, probe selection, and data processing influence accuracy and repeatability in practical measurement scenarios.
READERS WILL LEARN:
RESOURCE TYPE: Real-time technical demonstration
LENGTH: ~10 minutes