Knowledge Pack: Thin Film Characterization with Ellipsometry and Reflectometry

_DESCRIPTION:

Bruker experts discuss and demostrate spectroscopic reflectometry and ellipsometry techniques and the advantages of polarized light methods for measuring thin films — specifically films on silicon and today's complex semiconductor devices (multi-layer/multi-stack). Topics include theoretical fundamentals, accuracy and measurement ranges, Bruker's unique algorithms and hardware implementations, and real-life use cases in both medical device and semiconductor applications.

_{VIEWERS WILL LEARN:}

- How reflectometry and ellipsometry each measure film thickness and material optical properties
- How to get more complete thin-film measurements by combining spectroscopic reflectometry and ellipsometry
- When advanced multi-angle optical techniques are necessary
- Real-world application examples in medical device and semiconductor manufacturing
- Key considerations for instrument selection, including detection limits, metal films, transparent polymers, and turnkey options

Presented by: Chris Claypool, Sr. Director, R&D, FilmTek Products (November 17, 2022)

_DESCRIPTION:

Bruker experts introduce advanced multi-angle spectroscopic reflectometry and ellipsometry for the high-resolution thickness and refractive index demands of silicon photonics and planar waveguide applications. The discussion highlights how non-contact FilmTek techniques achieve significantly higher refractive index resolution than conventional prism coupler methods across materials including SiON, Si₃N₄, Ge‑SiO₂, P‑SiO₂, BPSG, APOX, and HiPOX.

_{VIEWERS WILL LEARN:}

- Why precise film thickness and refractive index measurement is critical for photonic device performance
- Advantages and limitations of different measurement approaches for multi-layer photonic structures
- When conventional optical tools reach their limits and how combining reflectometry and ellipsometry at multiple angles overcomes those limitations
- How multi-angle spectroscopic techniques achieve a 10× refractive index resolution advantage over prism coupler methods
- How non-contact methods support R&D characterization and automated in-line process control

Presented by Lawrence Rooney, Senior Application Scientist, Bruker (December 6, 2023)

_DESCRIPTION:

Bruker experts show how FilmTek optical metrology tools — using spectroscopic reflectometry, spectroscopic ellipsometry, and multiple-angle reflectometry — support thin-film characterization for front-end semiconductor process control. The presentation shows how combining multi-angle deep-UV reflectance and ellipsometry data expands measurement capabilities beyond the known limits of individual techniques, with real-world examples from sub-nanometer dielectric films to 200 µm-deep MEMS trench structures.

_{VIEWERS WILL LEARN:}

- How combining reflectometry and ellipsometry removes ambiguity that single techniques cannot
- How to measure ultra‑thin films while resolving both thickness and refractive index
- How non-contact methods support R&D characterization and automated in-line process control
- What to consider when measuring complex multi‑layer stacks such as ONO structures
- How small, collimated measurement spots enable accurate results on patterned wafers
- Advantages and limitations of different measurement approaches for multi-layer photonic structures

Presented by Christopher Claypool, Senior R&D Director, for filmtek Products, Bruker (March 15, 2023)