Knowledge Pack: Nanomechanical Testing of Thin Films

Ultimate Solution for Ultra-Thin-Film Systems

^{RESOURCE TYPE: Application Note [PDF]
LENGTH: 2 pages}

^DESCRIPTION:
This application note explains the principles of nanoindentation as applied to thin films, including how hardness and elastic modulus are measured when substrate influence becomes significant, the relationships between indentation depth, deformation zone, and film thickness, and how these factors define both measurement capability and limitation in ultra‑thin systems. Depth‑dependent analysis approaches are used to demonstrate how intrinsic thin‑film properties can still be extracted, even when conventional “10% of thickness” rules are no longer practical.

_{READERS WILL LEARN:}

• How to measure thin film hardness and modulis using nanoindentation methods

• Why substrate influence emerges as a function of indentation depth

• How to determine whether the measurement reflects film properties, substrate properties, or a combination of both

• What measurement and analytical methods are used to extract intrinsic thin‑film properties from depth‑dependent data

Thin Film Characterizations Applied in Semiconductor Industries

^{RESOURCE TYPE: Webinar
LENGTH: ~1 hour}

Thermomechanical Integrity of Thin Films and Nano-Interconnects

^{RESOURCE TYPE: Webinar
LENGTH: ~45 minutes}

• [00:00:00] About IMEC
• [00:08:19] Introduction and Motivation
• [00:11:20] Experimental Strategy for Thermo-mechanical Integrity of Thin Films and Nano-interconnects
• [00:18:17] Indentation-Based Fracture and Adhesion of Thin Films
• [00:34:06] Benchmarking Chip Package Interaction Integrity
• [00:43:26] Conclusions

In-Situ Mechanical Testing of Semiconductor Devices

^{RESOURCE TYPE: Application Note [PDF]
LENGTH: 3 pages}

^DESCRIPTION:
This application note demonstrates how nanomechanical testing is performed inside electron microscopy environments to study mechanical behavior in semiconductor devices, with a focus on BEOL structures composed of layered thin films. Using in‑situ testing workflows, the note shows how localized loading is applied while imaging the material response, enabling direct observation of deformation, cracking, and failure in interconnect stacks and thin‑film interfaces. Representative examples illustrate how structural changes evolve under load and how these observations are correlated with measured force and displacement data.

_{READERS WILL LEARN:}

• How nanomechanical tests are performed in SEM/TEM environments to combine mechanical loading with real-time imaging

• When to use in‑situ testing to investigate failure mechanisms in interconnect stacks, interfaces, and layered thin‑film systems

• Why direct observation during loading is required to understand deformation and failure that cannot be captured through post-test analysis

• What these measurements reveal about thin‑film behavior, including deformation, cracking, interface response, and failure progression in semiconductor device structures
  

Mechanical Characterization of Ultra-Low-k Dielectric Films

^{RESOURCE TYPE: Application Note [PDF]
LENGTH: 3 pages}

^DESCRIPTION:
This application note explores nanoindentation-based characterization of low‑k dielectric films, where low stiffness and limited thickness increase sensitivity to substrate influence and measurement conditions. Using wafer‑level measurement data, it shows how modulus and hardness vary across the film and how arrays of indents can be used to map spatial variation. The results illustrate how measured mechanical response relates to film integrity and reliability in device structures.

_{READERS WILL LEARN:}

• How modulus and hardness are measured in compliant thin films

• When substrate influence begins to dominate measured response in low‑k materials

• Why spatial variation must be evaluated using arrays of measurements

• What measured mechanical properties indicate about film reliability and performance

Adhesion Testing of Photosensitive Insulators to Passivation Layers Under Controlled Humidity

^{RESOURCE TYPE: Application Note [PDF]
LENGTH: 3 pages}

^DESCRIPTION:
This application note details nanoscratch- and indentation-based adhesion testing of thin‑film interfaces under controlled humidity. By tracking critical load and delamination events during testing, it shows how adhesion strength is quantified and how environmental conditions influence failure behavior. The results demonstrate how interface response changes under moisture exposure and how controlled testing improves relevance to real operating conditions.

_{READERS WILL LEARN:}

• How critical load is used to quantify thin‑film adhesion

• When delamination occurs during scratch or indentation loading

• Why environmental conditions such as humidity influence adhesion and failure

• What adhesion measurements reveal about interface reliability
  

Tape Test versus Nanoindentation for Thin Films and Coatings

^{RESOURCE TYPE: Application Note [PDF]
LENGTH: 2 pages}

^DESCRIPTION:
This application note compares traditional tape testing with quantitative nanomechanical approaches for evaluating thin‑film adhesion. Using side‑by‑side examples, it shows how nanoscratch and nanoindentation measurements identify critical load and failure events that are not captured by qualitative methods. The comparison highlights how quantitative techniques enable more reliable differentiation between coating systems and interface performance.

_{READERS WILL LEARN:}

• How nanoscratch and nanoindentation quantify adhesion using critical load

• When qualitative tape testing fails to differentiate coating performance

• Why quantitative methods are required for reliable comparison

• What adhesion measurements reveal about film-substrate interaction

Nanomechanical Analysis of Au Thin Film on Si

^{RESOURCE TYPE: Real-time technical demonstration
LENGTH: ~15 minutes}