On-Demand Session: Thermomechanical Integrity of Thin Films and Nano-Interconnects
Learn about nanoindentation-based methods to improve thermomechanical design of integrated structures
PRESENTATION HIGHLIGHTS:
- [00:00:00] About IMEC
- [00:08:19] Introduction and Motivation
- [00:11:20] Experimental Strategy for Thermo-mechanical Integrity of Thin Films and Nano-interconnects
- [00:18:17] Indentation-Based Fracture and Adhesion of Thin Films
- [00:34:06] Benchmarking Chip Package Interaction Integrity
- [00:43:26] Conclusions
Q&A
PRESENTATION HIGHLIGHTS:
- [00:00:24] For the wedge indentation testing, is the lamination area measurement a topographical base measurement?
- [00:01:50] How do you calibrate your force at elevated temperatures in the indentation experiment?
- [00:03:23] Regarding the OSG material, is that a polymer or glass?
- [00:04:38] What efforts are required for four-point bending compared to indentation testing?
