Ellipsometry and Reflectometry Systems
Non-Contact Inline Metrology for Film Analysis
Featuring exclusive and patented technology for spectroscopic ellipsometry and reflectometry, multiple-angle reflectometry, and reflection-transmission spectrophotometry, Bruker’s extensive FilmTek™ product line enables more precise and repeatable measurements on the widest range of film types and thicknesses, enabling applications that are not feasible with other metrology systems.
FilmTek tools achieve best-in-class accuracy and refractive index resolution for many thick, thin, and multilayer films, and are available from fab to lab with a variety of automation options to suit individual customer requirements. Contact us or request a quote to discuss your unique measurement needs with a Bruker applications expert.
Find the Best FilmTek Metrology System for You
Versatile, High-Efficiency Semi Manufacturing-Specific Solutions
FilmTek systems provide non-contact thin-film metrology for semiconductor manufacturing, delivering film thickness, refractive index, composition, crystallinity, roughness, TTV, and critical dimension measurements that are often beyond the capabilities of conventional equipment. With best-in-class accuracy and refractive index resolution across thick, thin, and multilayer films, they support a broad range of wafer-level process control and characterization applications on diverse semiconductor materials and structures.
Installed in leading semiconductor development labs and high-volume manufacturing facilities worldwide, FilmTek platforms support the full path from process development and qualification through inline production monitoring and process control. Contact us to discuss your measurement requirements, find out about the systems best-suited for your application, discuss options for system specialization, or request a quote based on your specific needs.
Broad Thin-Film Metrology Capabilities
Measure a wide range of properties across diverse materials and thickness ranges, including:
- Properties: film thickness, refractive index, total thickness variation (TTV), composition and crystallinity, critical dimensions (CD), and roughness
- Layer thickness: from bare substrate (<1 Å) to very thick (2 mm)
- Sample types: dielectrics, semiconductors, III-V films, thin metals, metal oxides
Inline Process & Composition Control
Support process monitoring and characterization of thin-film properties across semiconductor manufacturing applications.
- Inline control for multi-layer film thickness and refractive index on micron-sized device features
- Inline composition control (e.g., %Ge in SiGex) for thin films
- Inline process control of thin metal oxide thickness to prevent non-wet open failures
3D Structure Metrology
Measure critical dimensions and structural features with high throughput and repeatability.
- Inline monitoring of high aspect ratio TSV depth and CD
- Accurate, high-throughput trench depth measurement
Silicon Photonics Film Characterization
Characterize optical films used in photonic device fabrication with high-resolution thickness and refractive index measurements.
- High-resolution measurement of film thickness and refractive index for silicon photonics (e.g., SiON, Si₃N₄)
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