On-Demand Session | 30 Minutes

Depth-Sensing Nanomechanical Characterization of Thin Films and Coatings: A Primer

Input value is invalid.

Access Video On-Demand

Submit the form for instant, full-length access to this session and related recordings from this event. In this session, Sandip Basu, Ph.D. (North American Application Manager, Bruker) discusses and demonstrates the use of dynamic nanoindenation testing for thin film measurement. 


Learn how to measure the viscoelastic mechanical properties of films using advanced nanoindentation methods.

  • Compare the advantages and practical limitations of quasi-static and dynamic nanoindentation for thin film measurement.
  • Understand how to correctly configure the Hysitron TI 980 for thin film samples.
  • See Bruker's Hysitron TI 980 in use, in real time, and learn how to perform a detailed analysis of the resulting nDMA force curves.
  • Hear expert answerd to audience questions about the best and most effective uses of nanoindentation for film and coating samples.


Please enter your first name
Please enter your last name
Please enter your e-mail address
Please enter a valid phone number
Please enter your Company/Institution
What best describes your current interest?
Please add me to your email subscription list so I can receive webinar invitations, product announcements and events near me.
Please accept the Terms and Conditions


* Please fill out the mandatory fields.

Note: You will be redirected to the recording after form submission.
After a few moments, you should also receive an email at the address provided that contains a link to re-access the viewing page.


In this demonstration, the presenter will use Bruker's Hysitron TI 980 nanomechanical test system to show how nanoindentation testing bridges the gap between macro-scale measurement and micro-scale measurement.

Dynamic nanoindentation (nDMA) involves applying a sinusoidal oscillation to the probe during the whole indentation process to calculate phase lag and force and displacement amplitude at every point in the loading and unloading segment. From this, we can calculate storage and loss components for the modulus, and also the damping behavior of the material as well. This will give information about the viscoelastic properties of the sample as a function of depth, rather than only at the point of maximum load. 

We discuss the capabilities and ideal configuration of the instrument for thin film measurement, including how to keep the strain rate of the deformation constant and how to adjust the maximum peak force so that the test produces enough deformation to see some of the interesting characteristics of these nanoindentation measurements on a film substance. Then, we record the force and displacement response as the probe is pressing into the material during the whole loading and unloading segment, and once the test is done we go back and analyze the data. If there is a large enough deformation we will also be able to optically analyze or collect an image of that deformation.