Nanomechanical Metrology

Hysitron ATI 8800

Automated thin film mechanical and interfacial adhesion metrology
Hysitron ATI 8800

Highlights

Fully-Automated Nanomechanical Metrology for In-Line and Near-Line Process Monitoring

Hysitron ATI 8800

Bruker’s Hysitron ATI 8800 nanomechanical metrology equipment enables companies to efficiently monitor the mechanical reliability of their products by rapidly identifying unexpected process changes though quantifiable variations in the measured mechanical properties and/or interfacial adhesion values. Nanomechanical metrology enables rapid identification of process variations to improve yields, increase product reliability, validate new processes, decrease time to market, and minimize operating costs. Measurements are fully automated with the ability to continuously monitor thin film modulus, hardness, and interfacial adhesion in a high-volume manufacturing environment.

Automated
300mm wafer handling
Fully automated for in-line or near-line nanomechanical metrology.
Precision
Highest Sensitivity Measurements
Exclusive transducer technology provides the highest level of measurement resolution and stability.
Identify
Physical property uniformity
Measure modulus, hardness, thin film adhesion over any area of a wafer.

Features

Features

Industry-Leading Nanoindentation

A small force is applied to a diamond probe with a well-known geometry while the probe displacement into the material’s surface is continuously monitored. The resulting load-depth curve is the “mechanical fingerprint” of the material and is used to quantitatively calculate the mechanical properties.

Nanoindentation is applicable to every material used in the device manufacturing process. Modulus and hardness measurements are highly sensitive to changes in material composition, porosity, and thickness.

Nanoscratch Adhesion

A linearly increasing normal force is applied to the thin film as the scratch probe is translated in the lateral direction. As the probe approaches the film/substrate interface, the applied stress by the translating probe causes interfacial adhesion failure.

Nanoscratch is a fast and repeatable in-fab technique to monitor the interfacial adhesion of thin films. A 1:1 correlation can be made between nanoscratch adhesion results and four-point bend tests.

Applications

Applications

Thin Film Mechanical and Adhesion Uniformity

The ATI 8800 provides highly localized mechanical property and interfacial adhesion measurements that enables the ability to quantitatively measure variations in different regions of the wafer.

Process Monitoring

Rapid advances in technology require that the majority of new products are developed using new materials and modified processes. With each new material, process, or thickness it is not possible to refer to the reliability achievements of previous devices. Given the current and future materials and thicknesses being used, there is very little room for error.

Continuous statistical sampling of the nanomechanical properties of deposited films yields great knowledge of process drift and structure changes, traditionally requiring several slower metrology tools to identify the problems.

Contact Expert

Contact Us

* Please fill out the mandatory fields.

Please enter your first name
Please enter your last name
Please enter your e-mail address
Please enter your Company/Institution
What best describes your current interest?
Please add me to your email subscription list so I can receive webinar invitations, product announcements and events near me.
Please accept the Terms and Conditions

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.