Production Photomask Haze Mitigation and Removal
The Bruker Rhazer-III® system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is clean and dry.
Photo-induced micro-contamination on photomasks (haze) has become an increasingly pervasive and costly problem throughout the semiconductor industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution. The Bruker Rhazer-III® system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is clean and dry. Processing the mask does not require removal of the pellicle and causes no damage to the mask absorber materials and no changes to phase, transmission or CDs, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.