Photomask Repair

Extreme Lithography Cleaner

2nd Generation Photomask Dry Cleaning System

Production CO₂ Cryogenic Particle Removal

Extreme Lithography Cleaner (EL-C)

EL-C® systems are used for a wide variety of applications including front-side and back-side removal of particles deposited during production and handling, especially particle adders from other equipment. The EL-C process is dry and contamination free. Masks can be cleaned as often as needed with 100% soft particle removal efficiency down to 50nm sizes.

CO₂ dry cleaning
production-proven process
Operating on advanced technology node masks at multiple sites worldwide including wafer fabs and mask shops
Full front and back side
cleaning of optical and EUV masks
With features geometries having aspect ratios as high as 3:1
No damage
over 50+ CO₂ clean cycles
No damage to fragile structures or to SRAFs ≥40nm; No transmission or reflection effects; No absorber damage
soft particle removal efficiency

Cryogenic Aerosol Photomask Cleaning Supporting Full Mask Clean

Unknown particle contamination on advanced photomasks during manufacture and mask handling in wafer fabs has been and remains a consistent problem. As mask materials become more sophisticated and geometries continue to shrink, the need for more efficient and damage free cleaning techniques has become increasingly important. Many of the older, established cleaning technologies have become less effective at soft particle removal and have become sources of feature damage and mask surface contamination. Several years ago, Bruker introduced a new mask cleaning alternative in the form of the Extreme Lithography Cleaner (EL-C®) product line of full mask cryogenic dry clean systems. The Bruker EL-C® system is now in production operation in multiple mask shops and in the mask management facilities of worldwide wafer fabs.

Fully Automated or Manual Load Operation

  • SMIF & Overhead Track compatible; RFID/OCR/Barcode readers
  • SECS/GEM compatible
  • Easy to operate; Highly user friendly GUI

Multiple Mask Cleaning Applications

  • EUV & Optical Front-side cleaning
  • EUV & Optical Back-side cleaning
  • Full mask clean
  • Local area (spot) clean
  • Pre-repair clean (differentiate “soft” verses “hard” defects)
  • Post-repair clean (nanomachining debris)
  • Persistent particle clean
  • Removal of adders from other equipment
  • Mask blank clean


How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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