Knowledge Pack: 3D Optical Profiler Characterization of Thin Films

Introduction, Technology Refresher, and Basic Film Measurement Workflows

^{RESOURCE TYPE: Video

LENGTH: ~10 minutes}

_{PRESENTATION HIGHLIGHTS:}

[00:01:50] Technical capabilities and data outputs of Bruker's WLI-based optical profilers
[00:04:50] How WLI works and how to read optical profilometry data for films and coatings
[00:06:15] Analysis of thick opaque films
[00:07:05] Analysis of thick transmissive films
[00:09:15] Analysis of thin films

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_DESCRIPTION:

Bruker applications specialists introduce the core principles of 3D optical profilometry for thin‑film and coated‑surface characterization. The discussion focuses on what the technique measures, how measurements are performed, and how results are interpreted in thin‑film applications. Emphasis is placed on establishing consistent terminology, conceptual grounding, and a clear understanding of how optical surface data supports thin‑film analysis.

_{VIEWERS WILL LEARN:}

- How white‑light interferometry works for thin‑film measurement
- What surface parameters a 3D optical profiler measures
- How thin‑film measurements are acquired and interpreted
- Core terminology and concepts used across optical surface metrology

Presented by Ian Armstrong, Ph.d., North America Applications Manager, Bruker (June 9, 2021)

Start at 1:54

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Thickness Measurements of Opaque and Transparent Films or Coatings with WLI

^{RESOURCE TYPE: Application Note [PDF]

LENGTH: 4 pages}

^DESCRIPTION:This application note details the measurement physics and configurations used to determine thin‑film thickness with WLI. It describes how interference signals from the film surface and substrate are used to calculate thickness, and how measurement strategies differ for opaque versus transparent films. Illustrative example data is included to reinforce the fundamentals and show how thickness values are derived and validated.

_{READERS WILL LEARN:}

How to derive film thickness from WLI interference signals

Differences between opaque and transparent film measurement strategies

When step‑height vs through‑film measurements are appropriate

How to interpret example thickness measurement data

Full‑Area Optical Surface Texture Measurement with 3D Optical Profilers

^{RESOURCE TYPE: Video

LENGTH: ~30 minutes}

Watch the full-length webinar

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_DESCRIPTION:

Bruker metrology specialists place 3D optical profilometry (WLI) within the broader context of surface metrology. The discussion compares WLI with stylus scanning, confocal microscopy, and focus variation, highlighting differences in contact vs non‑contact measurement, data density, and applicable surface types. Accuracy, vertical and lateral measurement scales, and achievable resolution are explained, with real use cases — such as ranking surface finishing processes and calculating wear volume — used to demonstrate practical applicability.

_{VIEWERS WILL LEARN:}

- How WLI compares to stylus, confocal, and focus‑variation techniques
- Vertical and lateral scales captured by 3D optical profiling
- Accuracy and resolution considerations for surface texture measurement
- Practical examples including finishing‑process ranking and wear‑volume calculation

Presented by Samuel Lesko, Ph.D., Dir. of Technology and Apps Development for Tribology, Stylus & Optical Profilers, Bruker (April 29, 2021)

Start at 38:48

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Performing Comprehensive Wafer Inspection with Non‑Contact 3D Optical Profiling

^{RESOURCE TYPE: Application Note [PDF]

LENGTH: 4 pages}

^DESCRIPTION:This application note explores how 3D optical profilometry scales to wafer‑level inspection, integrating thin‑film measurement into broader semiconductor device and packaging workflows. Using real inspection data, the note shows how full‑field optical measurements capture multiple surface parameters simultaneously and support efficient, non‑contact inspection of thin films on patterned and fragile wafers.

_{READERS WILL LEARN:}

How WLI is applied to wafer‑scale inspection

How thin‑film measurements fit into device and packaging workflows

What surface parameters can be extracted from a single scan

Practical considerations for non-contact wafer inspection

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Characterization of CMP Processes with White Light Interferometry

^{RESOURCE TYPE: Application Note [PDF]

LENGTH: 6 pages}

^DESCRIPTION:This application note presents a process‑focused case study showing how WLI is used to characterize thin‑film surfaces before and after chemical mechanical planarization (CMP). Before‑and‑after measurement data is used to quantify changes in surface topography and connect surface topography changes to process performance and outcomes.

_{READERS WILL LEARN:}

How WLI is applied to CMP process evaluation

How surface topography changes are quantified before and after CMP

How measurement data is used to compare process conditions

How optical profiling relates to CMP performance outcomes

Measuring Thickness of a Sellotape/Kapton Tape Film

^{RESOURCE TYPE: Real-time technical demonstration

LENGTH: ~10 minutes}

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_DESCRIPTION:

In this expert‑led demonstration, Bruker specialists apply WLI measurement concepts to a real thin‑film sample, using a Sellotape/Kapton tape multi-layer film to show how measurements are executed and interpreted in practice. The demo reinforces how optical profiler data is collected, visualized, and analyzed, serving as a concrete “see it in action” example following the conceptual and application‑level content.

_{VIEWERS WILL LEARN:}

- How WLI measurements are performed on a real film sample
- How to interpret surface and film‑related data
- How theoretical concepts translate into practical measurement steps
- Common considerations when analyzing thin‑film measurement results

Presented by Ian Armstrong, Ph.d., North America Applications Manager, Bruker (June 9, 2021)

Start at 10:25

Transparent Thin‑Film Thickness Measurement

^{RESOURCE TYPE: Real-time technical demonstration

LENGTH: ~35 minutes}

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_DESCRIPTION:

Bruker applications experts demonstrate real‑time thin‑film thickness measurement using WLI on a transparent coating applied to the inside of a soda can. Bruker metrology experts walk through instrument and software setup, live data acquisition, fringe identification, and thickness calculation, demonstrating how interference signals from the film surface and substrate are separated and combined to determine film thickness on a curved, internal surface.

_{VIEWERS WILL LEARN:}

- How to configure hardware and software for transparent‑film thickness measurement
- How interference fringes from film and substrate are identified and separated
- How thickness is calculated from optical signal differences
- How WLI handles transparent films and challenging geometries

Presented by Vishal Panchal, Ph.D., Sales Applications Scientist, Bruker (April 29, 2021)

Start at 01:03:51

Knowledge Pack: 3D Optical Profiler Characterization of Thin Films

Introduction, Technology Refresher, and Basic Film Measurement Workflows

Thickness Measurements of Opaque and Transparent Films or Coatings with WLI

Full‑Area Optical Surface Texture Measurement with 3D Optical Profilers

Performing Comprehensive Wafer Inspection with Non‑Contact 3D Optical Profiling

Characterization of CMP Processes with White Light Interferometry

Measuring Thickness of a Sellotape/Kapton Tape Film

Transparent Thin‑Film Thickness Measurement

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