The performance, repeatability, and reliability of microelectromechanical systems depend on the combined mechanical and tribological response of the individual materials comprising the device. As design processes become more complex, the ability to quantitatively measure and modify mechanical properties is required for designing new MEMS devices and shorten design timelines. The physical dimensions of materials used in MEMS devices allow bulk mechanical properties to be used as a starting point from which to work, but large variations can be observed over the nanoscale-to-microscale due to microstructure differences, residual stress, and surface/edge driven effects. Additionally, mechanical and tribological properties of thin films and small structures are oftentimes strongly affected by their processing history, such as deposition method, temperature, pressure, and etchant exposure. Considering the surface properties are frequently the determining factor in the performance of MEMS devices, quantitative nanomechanical and nanotribological characterization is critical for continued MEMS development.
