Thin Film Characterization | Bruker

Thin Films (50nm-500nm)

Quantitative Nanomechanical, Nanotribological, and Interfacial Adhesion Characterization of Thin Films

Thin films are used in a variety of industries to provide specific electronic, optical, thermal, tribological, and passivation characteristics. Typically films in this thickness range are deposited using complex gaseous, vapor, or plasma processes. Tight control and optimization of thin film of deposition parameters are required to obtain films with desired properties. The ability to measure and understand thin film mechanical and tribological properties is critical for continued materials development and process integration.

Bruker has developed a versatile suite of nanomechanical and nanotribological characterization techniques for thin film characterization. A variety of nanoindentation techniques are available to quantitatively measure the modulus, hardness, fracture toughness, creep, stress relaxation, and viscoelastic properties of thin films under several environmental conditions. Combining high precision test placement accuracy with mechanical property depth profiling capabilities enable a comprehensive understanding of thin film structure, property, processing, and performance relationships. Patented thin films analysis models subtract substrate effects from the measured film/substrate response to provide intrinsic thin film elastic properties. Additionally, highly sensitive two dimensional transducer technologies deliver reliable nanoscale tribological characterization and quantitative thin film interfacial adhesion measurements.

Application Notes

Standalone Test Equipment for Quantitative Thin Film Characterization

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Test Equipment for Quantitative Thin Film Characterization

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.


Hysitron PI 95 TEM PicoIndenter | Bruker

PI 95 TEM PicoIndenter

The first full-fledged depth-sensing indenter capable of direct-observation nanomechanical testing inside a transmission electron microscope (TEM).


Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.