Nanoscale and Microscale Mechanical Properties | Bruker

Mechanical Properties

Quantitative Characterization at the Nanoscale and Microscale

Nanomechanical testing encompasses a comprehensive set of techniques for determining a broad set of mechanical properties at sub-micrometer length scales. Indentation testing has been utilized for over a century to determine the hardness of materials. Advances in indentation-based mechanical testing over the past decades has enabled quantitative characterization of many additional material parameters at the nanoscale; such as elastic modulus, viscoelastic properties, creep and stress relaxation behavior, interfacial adhesion, and fracture toughness. The ability to quantitatively measure mechanical properties at the nanoscale has been critical for making revolutionary advances in materials development.

The importance in understanding and controlling unique material behavior at the nanoscale goes far beyond thin films and low dimensional materials. The ability to quantitatively characterize and tailor the mechanical properties of individual microstructures/phases/constituents/interfaces in bulk materials has brought on a new era of structure–properties relationships to be exploited. Bruker has developed the broadest suite of nanomechanical testing techniques for quantitative characterization of nanoscale mechanical properties.


Quantitative Nanomechanical Characterization

Elastic Modulus | Bruker

Elastic Modulus

Quantitatively measure the indentation modulus of localized microstructures, interfaces, small surface features, and thin films.

Hardness Characterization | Bruker

Hardness

Reliably obtain quantitative hardness values from the nanoscale into the microscale.

Viscoelastic Property Characterization | Bruker

Viscoelastic Properties

Quantitatively measure the viscoelastic properties of small volumes of material and localized regions of sample surfaces.

Nanoscale Creep Characterization | Bruker

Creep

Quantitative creep characterization of thin films, individual microstructures, functionally graded interfaces, and small surface structures.

Stress Relaxation Characterization | Bruker

Stress Relaxation

Quantitatively measure the stress relaxation on a range of materials, from thin films to individual phases of complex microstructures.

Interfacial Adhesion | Bruker

Interfacial Adhesion

Quantitative measurement of interfacial adhesion characteristics of ultra-thin films, down to a couple nanometers in thickness.

Fracture Toughness | Bruker

Fracture Toughness

Quantitative measurement of fracture toughness at the nanoscale and microscale.