Interfacial Adhesion | Bruker

Interfacial Adhesion

Quantitative Interfacial Adhesion Characterization of Thin Films and Coatings

Nanoindentation and nanoscratch are two common techniques for measuring the interfacial adhesion thin film/substrate systems. There are multiple ways in which these techniques are used for interfacial adhesion characterization, but all are based on supplying a well-known stress to the film/substrate interface and identifying delamination events though sudden changes in probe/film contact conditions. During a nanoindentation test, interfacial adhesion is determined using site-specific material properties and the dimensions of the delaminated region, either caused by buckling or indentation-induced blister formation. Nanoscratch testing increases the normal force acting on the scratch probe as it is translated tangential to the sample surface. The normal force at which delamination occurs during a nanoscratch test is known as the critical load of interfacial adhesion and is closely tied to the film/substrate interfacial adhesion energy. Both nanomechanical testing techniques provide fast, reliable, and quantitative interfacial adhesion characterization of thin films in their as-deposited state.

Bruker is the industry-leader for thin film interfacial adhesion measurements. Bruker’s patented electrostatic transducer technologies provide high-sensitivity force and displacement measurements, critical to detecting the initial onset of delamination during the nanomechanical test. In-situ SPM imaging capabilities enable high resolution topography mapping post-test to quickly measure the size of the delamination and observe material deformation behavior. Algorithms built into the TriboScan™ software package automatically identify critical loads of interfacial adhesion values and automated measurement routines allow rapid nanoscale mapping of adhesion properties across blanket thin films. Bruker technologies enable quantitative measurement of the interfacial adhesion characteristics of ultra-thin films, down to a couple nanometers in thickness.

Standalone Equipment for Interfacial Adhesion Characterization

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Instruments for Interfacial Adhesion Characterization

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.

 

Hysitron PI 95 TEM PicoIndenter | Bruker

PI 95 TEM PicoIndenter

The first full-fledged depth-sensing indenter capable of direct-observation nanomechanical testing inside a transmission electron microscope (TEM).

 

Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.