Preferred Choice of Leading Foundries and Memory Makers
InSight AFP is the world’s highest performance and industry preferred CMP profiling and etch depth metrology system for advanced technology nodes. The combination of its modern tip scanner with inherently stable capacitive gauges and an accurate air-bearing positioning system enables non-destructive, direct measurements in the active area of dies.
InSight AFP's TrueSense® technology, with the proven long-scan capability of an atomic force profiler. Etch depth, dishing, and erosion on submicron features can be monitored fully automated with unsurpassed repeatability without relying on test keys or models. It’s unique
The Insight AFP combines the latest innovations in atomic force microscopy, including Bruker’s proprietary CDMode characterizing sidewall features and roughness. CDmode reduces the amount of required cross-sectioning, realizing significant cost savings. In addtion, AFP data provides a direct side-wall roughness measurement that cannot be obtained through other techniques.
The device killing defects of today's leading ICs are smaller than ever and require rapid resolution for HVM demands. The InSight AFP provides fast, actionable topographical and material information about defects on semiconductor wafers and phtomasks that allows manufacturers to rapidly identify sources of defectivity and eliminate their impact on production.
100x high-resolution registration optics and AFM Global Alignment enable less than ± 250 nm raw image placement accuracy for patterned wafer and mask ensuring that the defect of interest is the defect measured.
The system is fully compatible with KLARITY and most other YMS systems.
Profiling speeds up to 36,000 µm/sec enables rapid, full 3D post-CMP characterization and inspection for full 33 mm x 26 mm flash fields and larger. Sub 2 nm out-of-plane motion for true large-scale topography and fully automated post polish hot spot detection.
In this example a full, standard, 26 mm x 33 mm reticle field scan was acquired in 24 hours at 1 micron x 1 micron pixel size. Hot spots may then be automatically detected and rescanned using Bruker's Hot Spot Detection and Review capability.
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.