Thin film analysis
Thin film analysis
Electronic Components (RoHS)

PCB Thickness and Composition

Controlling the thickness and composition of layers in PCB devices is important for their durability as well as for soldering or bonding.

Layer Analysis

Bruker offers analytical solutions to investigate PCB layers with EDS (StrataGEM) and micro-XRF (XMethod) techniques.

Where the electron excitation is particularely good for thinner films (up to hundreds of nm) and light elements, micro-XRF can investigate thicker layers and stacks of layers. Both StrataGEM and XMethod can simulaneously determine the mass coverage/thickness and the layers composition of films.