Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.
We are pleased to present this 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.
As demand for high-performance thin and ultra-thin films continues to grow, the success and competitive standing of manufacturers within these industries depends more and more on their understanding of the intrinsic mechanical properties of thin films and the relationship between those properties and product quality. Success also depends on the practical application of that knowledge for both R&D and in-line testing purposes.
This puts manufacturers under ever-increasing pressure to identify and adopt leading-edge, high-accuracy, high-throughput manufacturing tools and processes capable of collecting detailed measurements from thin- and ultra-thin samples. Nanoindentation and nanoscratch testing meet manufacturers' needs and have become the most widely used techniques to navigate these challenges.
In this webinar series, Bruker Applications Scientist Pal-Jen Wei, Ph.D., provides a detailed exploration of the principles and practical applications of nanoindentation and nanoscratch testing of thin films for industrial applications. This includes showing viewers how to analyze data and perform calculations for the measurement of hardness and modulus, adhesion, and cohesion (fracture toughness) while also controlling the conditions of the test environment.
Find out more about the technology featured in this webinar or our other solutions for Thin Film Measurements:
Pal-Jen Wei, Ph.D.
Applications Scientist, Bruker