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Nanomechanical Testing Webinars

Thin Film Measurements Webinar Series

presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker
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Learn how to collect high-accuracy, high-confidence thin film hardness, adhesion, and cohesion measurements under controlled environmental conditions.

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Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.

We are pleased to present this 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.

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For more information about this webinar series or the products and techniques featured, please contact us.

Recorded August - September 2021

Collect High-Accuracy, High-Confidence Thin Film Property Measurements Under Controlled Environmental Conditions

As demand for high-performance thin and ultra-thin films continues to grow, the success and competitive standing of manufacturers within these industries depends more and more on their understanding of the intrinsic mechanical properties of thin films and the relationship between those properties and product quality. Success also depends on the practical application of that knowledge for both R&D and in-line testing purposes.

This puts manufacturers under ever-increasing pressure to identify and adopt leading-edge, high-accuracy, high-throughput manufacturing tools and processes capable of collecting detailed measurements from thin- and ultra-thin samples. Nanoindentation and nanoscratch testing meet manufacturers' needs and have become the most widely used techniques to navigate these challenges.

In this webinar series, Bruker Applications Scientist Pal-Jen Wei, Ph.D., provides a detailed exploration of the principles and practical applications of nanoindentation and nanoscratch testing of thin films for industrial applications. This includes showing viewers how to analyze data and perform calculations for the measurement of hardness and modulus, adhesion, and cohesion (fracture toughness) while also controlling the conditions of the test environment.

 

Speaker

Pal-Jen Wei, Ph.D., Bruker

Dr. PJ Wei is an Application Scientist at Bruker Nano Surfaces, responsible for application development and technical support of Nano-Mechanical, Nano-Tribological and Nano-Indentation instruments. His academic background was in mechanical engineering and nano-metrology. Dr. Wei obtained his Ph.D. at National Cheng Kung University, Taiwan; majoring in nano-mechanical properties of thin solid films. Prior to joining Bruker, Dr. Wei was an Assistant Prof. at the Nanotechnology and Micro-system Institute in Taiwan and then a senior engineer of RD department in Catcher Tech. He has published in over 30 peer reviewed international journal papers and has also presented at many international conferences.