The Hysitron PI 89 SEM PicoIndenter leverages the advanced imaging capabilities of scanning electron microscopes (SEM, FIBSEM, PFIB), making it possible to perform quantitative nanomechanical testing while simultaneously imaging. PI 89 further advances Bruker's market-leading capacitive transducer technology, which enabled the first commercial in-situ SEM nanomechanics platforms. Enabled testing techniques include nanoindentation, tensile testing, pillar compression, particle compression, cantilever bending, fracture, fatigue, dynamic testing, and mechanical properties mapping.
The compact design of Hysitron PI 89 allows for maximum stage tilt and minimum working distance to enable optimal imaging during testing. PI 89 offers researchers greater versatility and performance than competing systems:
Hysitron PI 89 utilizes Bruker’s proprietary sub-nanometer sensitivity transducer and piezo-driven flexure for intrinsically displacement-controlled and load-controlled tests:
In-situ mechanical data acquired with the Hysitron PI 89 are synchronized with SEM imaging and displayed side-by-side. This allows you to see the influence of defects, mechanical strain, and thermal or electrical stimuli on the performance, lifetime, and durability of engineered materials—from nanometer-to-micrometer scales. This synchronization enables a greater range of analyses:
The Hysitron PI 89's modular design supports a full suite of innovative in-situ testing techniques and two rotation and tilt stage configurations for advanced imaging and FIB milling.