Challenges in Thin Film Hardness, Modulus Measurement and Solutions

       _{PRESENTATION HIGHLIGHTS}

• [00:03:06] Introduction to mechanical properties of thin films and related metrology methods
• [00:06:07] Overview of instrumented indentation for testing nano-scale properties of thin films
• [00:11:32] Challenges of profiling the intrinsic mechanical properties of ultra-thin films
• [00:19:55] Solutions for characterizing the intrinsic mechanical properties of ultra-thin films
• [00:28:36] Bruker's solutions for nano-to-macro scale measurement of thin films and coatings

       _{LIVE Q&A WITH THE PRESENTER}

• [00:35:30] Is there any relationship between the elasticity and plasticity of the sample?
• [00:40:10] For SPM mode, are there any differences if the probe tip is indented in the same position or a different position?
• [00:42:26] What technique/tool can be used to measure wafer-to-wafer bonding samples?
• [00:45:05] What sample thickness range can be checked using TEM and SEM?
• [00:49:50] Why plot displacement on the X-axis?
• [00:54:08] What is the sample thickness limit when measuring hardness?