Nanomechanical Testing Webinars

Challenges in Thin Film Hardness, Modulus Measurement and Solutions

Thin Film Measurements Webinar Series Part 1/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker

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Learn how to improve the accuracy of mechanical property measurement for ultra-thin films.

  • Understand the root causes of the challenges researchers face when characterizing the mechanical properties of ultra-thin films.
  • Get practical guidance for using instrumented indentation to overcome sample thickness limits and substrate effects.
  • Understand the outcomes and advantages of instrumented indentation in various use cases.
  • Hear Bruker applications experts answer common questions posed by researchers studing thin films and coatings.
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Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.

We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.

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For more information about this webinar series or the products and techniques featured, please contact us.

Recorded August 12, 2021

Accurately Measure the Intrinsic Mechanical Properties of Ultra-Thin Films

The measurement of intrinsic thin film mechanical properties is of growing importance and a growing concern in high-tech industrial development. Manufacturers today are keen to overcome the limitations of 1/10 film thickness with substrate effect, and accurately measure the intrinsic mechanical properties of ultrathin films.

In the semiconductor and other high-tech industries, it is common for companies to use porous low-dielectric constant materials instead of solid silicon dioxide to reduce the resistance and capacitance delay. However, the porosity of such low-dielectric constant materials results in mechanical properties changes, causing much instability and reliability problems in the mass production process. A solution (or the spotlight/focus/onus) is therefore to evaluate and monitor the mechanical properties of low-dielectric constant materials, especially the elastic modulus and interface adhesion.

This webinar will focus on thin film intrinsic elastic modulus nanoindentation measurements and analytical methods based on contact mechanics, including calculation of the substrate effect and several exemplary nanomechanical measurement case studies.



Pal-Jen Wei, Ph.D., Bruker

Dr. PJ Wei is an Application Scientist at Bruker Nano Surfaces, responsible for application development and technical support of Nano-Mechanical, Nano-Tribological and Nano-Indentation instruments. His academic background was in mechanical engineering and nano-metrology. Dr. Wei obtained his Ph.D. at National Cheng Kung University, Taiwan; majoring in nano-mechanical properties of thin solid films. Prior to joining Bruker, Dr. Wei was an Assistant Prof. at the Nanotechnology and Micro-system Institute in Taiwan and then a senior engineer of RD department in Catcher Tech. He has published in over 30 peer reviewed international journal papers and has also presented at many international conferences.