We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.
The measurement of intrinsic thin film mechanical properties is of growing importance and a growing concern in high-tech industrial development. Manufacturers today are keen to overcome the limitations of 1/10 film thickness with substrate effect, and accurately measure the intrinsic mechanical properties of ultrathin films.
In the semiconductor and other high-tech industries, it is common for companies to use porous low-dielectric constant materials instead of solid silicon dioxide to reduce the resistance and capacitance delay. However, the porosity of such low-dielectric constant materials results in mechanical properties changes, causing much instability and reliability problems in the mass production process. A solution (or the spotlight/focus/onus) is therefore to evaluate and monitor the mechanical properties of low-dielectric constant materials, especially the elastic modulus and interface adhesion.
This webinar will focus on thin film intrinsic elastic modulus nanoindentation measurements and analytical methods based on contact mechanics, including calculation of the substrate effect and several exemplary nanomechanical measurement case studies.
FEATURED PRODUCTS AND TECHNOLOGY
Pal-Jen Wei, Ph.D., Bruker