Nanomechanical Testing Webinars

Thin Film Interface Adhesion Characterization for Industrial Applications

Thin Film Measurements Webinar Series Part 2/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker

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Learn to collect high-confidence  thin film adhesion measurements via nanoindentation and nanoscratch testing.

  • Understand the challenges researchers face when measuring the adhesion of thin films.
  • Find out how nanoindentation and nanoscratch testing supports in-line process innovation.
  • Identify and analyze the correlation between nanoindentation and nanoscratch test results.
  • Get practical guidance for using indentation-induced delamination to overcome the challenges posed by rough samples and high temperatures.
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Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.

We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.

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For more information about this webinar series or the products and techniques featured, please contact us.

Recorded August 26, 2021

Collect High-Confidence Adhesion Measurements—Even Under Non-Ideal Experimental Conditions

The widespread use of porous low-dielectric constant materials has rendered previous large-scale interface adhesion measurement technology obsolete in a very short period of time. At the same time (and ever since) nano-scratch techniques have progressively emerged as the only nano-scale thin film adhesion measurement solution for in-situ observations and quantitative measurements of film adhesion. This has led to large-scale adoption of nanoscratch and nanoindentation testing of porous low-dielectric constant materials as an in-line monitoring tool in multiple industries ranging from semiconductor to hard coating to display and anti-corrosion film industries.

This webinar will focus on explaining the concepts and applications of thin film interface adhesion and the complexities of direct imaging of nanoscratch and nanoindentation tests with a scanning electron microscope.



Pal-Jen Wei, Ph.D., Bruker

Dr. PJ Wei is an Application Scientist at Bruker Nano Surfaces, responsible for application development and technical support of Nano-Mechanical, Nano-Tribological and Nano-Indentation instruments. His academic background was in mechanical engineering and nano-metrology. Dr. Wei obtained his Ph.D. at National Cheng Kung University, Taiwan; majoring in nano-mechanical properties of thin solid films. Prior to joining Bruker, Dr. Wei was an Assistant Prof. at the Nanotechnology and Micro-system Institute in Taiwan and then a senior engineer of RD department in Catcher Tech. He has published in over 30 peer reviewed international journal papers and has also presented at many international conferences.