Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.
We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.
The widespread use of porous low-dielectric constant materials has rendered previous large-scale interface adhesion measurement technology obsolete in a very short period of time. At the same time (and ever since) nano-scratch techniques have progressively emerged as the only nano-scale thin film adhesion measurement solution for in-situ observations and quantitative measurements of film adhesion. This has led to the large-scale adoption of nanoscratch and nanoindentation testing of porous low-dielectric constant materials as an in-line monitoring tool in multiple industries ranging from semiconductor to hard coating to display and anti-corrosion film industries. In this webinar, you can expect to:
This presentation focuses on explaining the concepts and applications of thin film interface adhesion and the complexities of direct imaging of nanoscratch and nanoindentation tests with a scanning electron microscope.
Find out more about the technology featured in this webinar or our other solutions for Thin Film Interface Adhesion Characterization:
Pal-Jen Wei, Ph.D.
Applications Scientist, Bruker