Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.
We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.
Fracture toughness is an indicator of a material’s ability to resist crack propagation, regardless of crack’s size or shape and the stress applied to the crack itself. Precise fracture toughness measurement is increasingly important in industrial applications because of the trend towards thinner, stronger films; high-strength thin-film materials become more fragile with increasing strength
With the continual decrease of material thickness and increase of structural complexities, accurately measuring thin film fracture toughness has become a major focus of—and challenge to—manufacturers' failure analysis processes.
This webinar addresses and proposes practical solutions for the challenges manufacturers face—including film thickness, interface limitations, and crack length—when measuring thin film cohesion in various applications.
Find out more about the technology featured in this webinar or our other solutions for Measuring Thin Film Fracture Toughness:
Pal-Jen Wei, Ph.D.
Applications Scientist, Bruker