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Industrial Solutions of Measuring Thin Film Fracture Toughness

Thin Film Measurements Webinar Series Part 3/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker
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Learn to precisely measure thin film fracture toughness via nanoindentation and nanoscratch testing.

  • Understand how to precisely measure the different modes of fracture toughness on both vertical and horizontal interfaces.
  • Get practical guidance for using nanoindentation and nanoscratch testing to induce and analyze crack propagation and delamination.
  • Understand the challenges and available nanoindentation- and nanoscratch-based solutions for measuring cohesion in various use cases.
  • Hear Bruker applications experts answer common questions posed by researchers studing thin films and coatings.
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Product innovation in modern industries—especially the semiconductor, hard coating, and display industries—relies heavily on decreasing the thickness of thin-film components.

We are pleased to present this webinar as one part of our 4-part Thin Film Measurements Series, in which our experts provide the information manufacturers need about leading-edge nanomechanical testing technology for thin films measurement, complete with use case studies for a range of industrial applications.

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For more information about this webinar series or the products and techniques featured, please contact us.

Recorded September 9, 2021

High Precision, High-Resolution Thin Film Failure Analysis

Fracture toughness is an indicator of a material’s ability to resist crack propagation, regardless of its size or shape and the stress applied to the crack itself. Precise fracture toughness measurement is increasingly important in industrial applications because of the trend towards thinner, stronger films; high strength thin film structure materials become more fragile with increasing strength

With the continual decrease of material thickness and increase of structural complexities, accurately measuring thin film fracture toughness has become a major focus of—and challenge to—manufacturers' failure analysis processes.

This webinar addresses and proposes practical solutions for the challenges manufacturers face—including film thickness, interface limitations, and crack length—when measuring thin film cohesion in various applications.  

 

Speaker

Pal-Jen Wei, Ph.D., Bruker

Dr. PJ Wei is an Application Scientist at Bruker Nano Surfaces, responsible for application development and technical support of Nano-Mechanical, Nano-Tribological and Nano-Indentation instruments. His academic background was in mechanical engineering and nano-metrology. Dr. Wei obtained his Ph.D. at National Cheng Kung University, Taiwan; majoring in nano-mechanical properties of thin solid films. Prior to joining Bruker, Dr. Wei was an Assistant Prof. at the Nanotechnology and Micro-system Institute in Taiwan and then a senior engineer of RD department in Catcher Tech. He has published in over 30 peer reviewed international journal papers and has also presented at many international conferences.