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Industrial Solutions of Measuring Thin Film Fracture Toughness

Thin Film Measurements Webinar Series Part 3/4. Presented by Pal-Jen Wei, Ph.D., Applications Scientist, Bruker

In this third session of our four-part Thin Film Characterization Webinar Series, viewers learn how to use nanoindentation and nanoscratch testing to induce cracking and delamination and calculate the fracture toughness of thin film samples.

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Industrial Solutions of Measuring Thin Film Fracture Toughness

Presented by PJ Wei, Ph.D., Applications Scientist, Bruker (September 9, 2021)

_{PRESENTATION HIGHLIGHTS}

[00:03:14] Introduction to thin film cohesion and fracture toughness measurement
[00:10:06] Fracture toughness calculation by hardness mapping and in-plane stress measurement
[00:14:00] Calculating fracture toughness on vertical interfaces using nanoscratch and nanoindentation methods
[00:26:27] Calculating fracture toughness on horizontal interface by in-situ methods
[00:42:12] Review of Bruker solutions

Q&A

_{LIVE Q&A WITH THE PRESENTER}

[00:46:23] When using the nanoscratch method, is the Normal force kept constant or does it increase during the measurement?
[00:47:20] Could you talk more about the modes used to measure fracture toughness? Are they related to each other?
[00:51:12] Is it possible to measure fracture toughness values using scratch testing at a higher load (ex. 20 N - 200 N)?