SEM PicoIndenter Series

Hysitron PI 85L

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes
Hysitron PI 85L SEM PicoIndenter

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In-Situ Nanomechanical Test Instrument

Hysitron PI 85L SEM PicoIndenter

Bruker’s SEM PicoIndenter instruments are depth-sensing nanomechanical test systems that are specifically designed to leverage the advanced imaging capabilities of scanning electron microscopes (SEM, FIB/SEM). With these systems, it is possible to perform quantitative nanomechanical testing while simultaneously imaging with the SEM. The Hysitron PI 85L SEM PicoIndenter is a dedicated in-situ nanomechanical test instrument that is designed for use in SEM, but also is suitable for a variety of platforms and environments. Featuring Bruker’s capacitive transducer working in conjunction with an extremely fast 78 kHz control system, the instrument provides exceptional performance and superior stability at nanoscale. The compact, low-profile design makes the system ideally suited for small-chamber SEMs, Raman and optical microscopes, beamlines, and more.

performance, stability and control
Delivers ultra-low noise floors, extremely fast feedback control and proprietary Q-control software for active dampening of vibrations.
in-situ mechanical testing platform
Supports a wide-range of mechanical testing modes, multiple control modes and interchangeable probes in a variety of geometries.
low-profile design
Provides easy installation ideal for small-chamber SEMs, Raman and optical microscopes, beamlines and more.


Designed for Performance and Versatility

The sample positioning stages of the Hysitron PI 85L are designed to accommodate samples up to 10 mm thick, while providing precise sample positioning with >3 mm range in all three directions (XYZ). In addition, the mechanical coupling of the sample stage and the transducer provides a stable, rigid platform for nanomechanical testing. Overall, this low-profile instrument allows for maximum stage tilt and minimum working distance for optimal imaging during testing.

In-Situ Mechanical Data Synchronized with SEM Imaging

FIB-milled back-end-of-line (BEOL) microbeam sample after mechanical testing and the corresponding load vs. displacement curve. Interfacial delamination is observed between the Cu layers and the brittle dielectric. Vanstreels, et. al., Appl. Phys. Lett. 105, 213102 (2014).

In-situ mechanical data acquired with the Hysitron PI 85L is synchronized with SEM imaging and displayed in side by side format. In the example at left, discontinuities in the load-displacement data are correlated to the onset of fracture observed in a FIB-milled beam containing copper interconnects and brittle dielectric material. Simultaneous mechanical measurements and SEM imaging enables a complete understanding of material deformation behavior.

Explore Behavior with Precise Modes

Post-indent imaging of three regions of the high-entropy alloy microstructure and low depth portion of the load-displacement curves for the three regions of interest.

The Hysitron PI 85L utilizes a multitude of different modes to test fundamental mechanical properties, stress-strain behavior, stiffness, fracture toughness, and deformation mechanisms in a variety of different samples.

In addition to the standard line-up of testing modes, the PI 85L can be upgraded with optional modes that further expand its capabilities. From heating options to electrical characterization, the PI 85L can adapt to your needs.


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