Cryogenic Wafer Cleaning


Non-Aqueos CO₂ Cryogenic Dry Cleaning

From Aggressive to Gentle

Environmentally Safe

Cryogenic Dry CO­­₂ Wafer Cleaning System

The Bruker Wafer Clean 2200 System removes particulate contamination and thin film organic residues from silicon, compound semiconductor, MEMS and thin film head substrates using a unique carbon dioxide (CO2) snow cleaning process. CO2 snow cleaning is fast, environmentally friendly and non-damaging. The all-dry process offers numerous advantages over conventional wet and plasma cleaning techniques. This fully automated, high volume production system is field proven with over 100 systems running 24/7 in high volume production applications around the globe.

25 WPH
Raster Scan movement
Global and local cleaning
Yield Improvement
Cleaning Efficiency down to 120nm
IBE Veil and Fence removal
Environmentally Safe
Solvent Free
ZERO Hazardous Waste


How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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