Thermomechanical Integrity of Thin Films and Nano-Interconnects
Characterize thermomechanical integrity with nanoindentation
An increasing number of material classes and complex geometries are found in integrated structures for semiconductor devices, elevating the importance of considering thermomechanical integrity to ensure optimal performance, reliability, and yield. Using nanoindentation-based characterization methods is a valuable way to understand thermomechanical integrity.
Webinar Summary
Thin films and nano-interconnects in the semiconductor industry necessarily consist of different classes of materials. As the amount of these material classes and the geometrical complexity of integrated structures increase, thermomechanical design becomes essential. Any issues with thermomechanical integrity can impact performance, yield, and reliability. In this webinar, several nanoindentation-based approaches will be demonstrated that can be used to study the thermomechanical integrity of thin films and nano-interconnects for semiconductor applications.
Find out more about the technology featured in this webinar or our other solutions for nanomechanical testing:
